#define LIN_ADVANCE_K 0.12 // start low #define LA_COOLSTEP 1 And ensure STEALTHCHOP is disabled on E driver. PLR writes to SD card every layer, causing wear and stuttering. Disable:
[tmc2209 stepper_x] uart_pin: PE11 run_current: 0.8 diag_pin: ^PC6 driver_SGTHRS: 65 two trees sapphire pro firmware
#define DEFAULT_AXIS_STEPS_PER_UNIT 80, 80, 400, 93 // X,Y,Z,E Requires LIN_ADVANCE and LA_DEBUG . But TMC2209 in StealthChop2 can cause skipped steps. Use: #define LIN_ADVANCE_K 0
// Sensorless homing sensitivity #define X_STALL_SENSITIVITY 65 #define Y_STALL_SENSITIVITY 65 #define TEMP_SENSOR_BED 1 // NTC 100k beta 3950 #define BED_MAXTEMP 120 #define HEATER_BED_PIN PB5 // SSR control #define SSR_RELAY 1 // inverted logic BLTouch / Probe #define BLTOUCH #define NOZZLE_TO_PROBE_OFFSET -45, -10, -2.8 // verify yours #define PROBING_MARGIN 20 #define MULTIPLE_PROBING 2 #define Z_CLEARANCE_DEPLOY_PROBE 10 LCD & SD #define CR10_STOCKDISPLAY // for Robin Nano's LCD #define SDSUPPORT #define LONG_FILENAME_HOST_SUPPORT #define SCROLL_LONG_FILENAMES 5. Common Modifications & Patches Fixing Z-Axis Binding The stock firmware often sets DEFAULT_AXIS_STEPS_PER_UNIT incorrectly for Z due to lead screw pitch mismatch. Standard Sapphire Pro uses T8x2 (2mm pitch, 8mm lead, 400 steps/mm @ 1/16 microstepping). Verify: But TMC2209 in StealthChop2 can cause skipped steps
[mcu] serial: /dev/serial/by-id/usb-Klipper_stm32f407xx_... [stepper_x] step_pin: PE8 dir_pin: PE9 enable_pin: !PE10 microsteps: 16 rotation_distance: 40 endstop_pin: tmc2209_stepper_x:virtual_endstop homing_retract_dist: 5
#define POWER_LOSS_RECOVERY false Or patch at runtime: M413 S0 AC beds have high thermal inertia. Use: